CALL FOR PAPERS
HOT INTERCONNECTS 9
A Symposium on High Performance Interconnects
Memorial Auditorium, Stanford University, Aug. 22-24, 2001
(Sponsored by the IEEE Computer Society)
Hot Interconnects is an international symposium focusing on the hardware
and software architecture and implementation of high-performance
interconnects of all scales. Its themes include cross-cutting issues
spanning computer systems and networking technologies for providing
universal services over packet networks. Examples of relevant topics
include network-attached storage, transport of voice and video over
packet networks, high-performance network interfaces, novel switching
and routing technologies capable of providing differentiated services,
plug-and-play network interfaces, and active network architectures. The
conference is directed particularly at new and exciting product and
technology innovations in these areas. Contributions should focus on
real products, prototypes, or experimental systems and their performance
evaluation. In addition to those subscribing to the main theme of the
conference, contributions are also solicited on the following topics:
- Gb/sec and Tb/sec switching and routing technologies
- High-speed packet processing engines
- Serial link technologies
- xDSL, HFC, and wireless access technologies
- Mobility-enabling technologies
- Seamless appliance interconnectivity
- Network-attached storage devices and interfaces
- Video and voice over packet networks
- Wireless and mobile network interfaces
- Network security
- Next-generation networking chip sets
- Network protocols on a chip
- Low-power networking and interconnect technologies
- Network appliance technologies
- Optical Interconnects
Submission Guidelines:
---------------------------------
Submissions must be in the form of extended summaries and should not
exceed 5 pages (double-column format). The summary should have
sufficient technical detail to judge its quality and suitability for
presentation at the conference. Guidelines for submission are available
at http://www.hoti.org.
Inquires about the conference should be directed to the TPC chairs.
Important Dates:
-----------------------
- Submission deadline: April 15, 2001.
- Notification of acceptance: May 15, 2001.
- Camera-ready due: July 1, 2001.
Organizing Committee:
---------------------------------
- General Chair: Fred Bauer, Nokia ([email protected])
- Technical Program Chairs:
- Marwan Krunz, University of Arizona ([email protected])
- John Lockwood, Washington University at St. Louis
([email protected])
- Tutorial/Panel: Ibrahim Matta, Boston University ([email protected])
- Treasurer: Melanie Swan, MS Financial Consulting
([email protected])
- Registration: Bob Wedig, Wedig Consulting ([email protected])
- Webmaster: Raymond Lee, IP Dynamics ([email protected])
- Local arrangements: Liz Rogers, Liz Rogers Design
([email protected])
- Publicity: TBD
Technical Program Committee: TBD
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